Nowadays, it is more and more difficult to design electrotechnique devices without considering thermal stress. In more and more applications (electric vehicles, electric aircraft, etc.) there is a need to reduce weight and cost, increase efficiency, whilst maintaining security. One possibility is to increase current for the same device, and therefore how to draw away the heat. This is why conventional approximations
need to be cross-checked with new tools. These new tools have to be quick and precise in order to run parametric and even optimisation analyses. Of course, thermal analysis is already available in the Flux suite for induction heating, induction hardening, forging, etc. Dedicated applications have been created to couple magnetic AC steady state to thermal transient analysis, for instance. What is new is easier
and more effective coupling any type of magnetic application to thermal analysis. This article reviews what thermal analysis is, when the different tools were created, and looks at the latest advances in thermal analysis.