Leverage your existing digital twin investment where it matters most - early in the product realization process when reliability, quality, and manufacturability are most easily optimized. Perform rigorous 2D and 3D physics analyses with system and circuit simulations to assure power integrity, signal integrity, and EMI for power delivery systems and high-speed channels in electronic devices. Improve electronics thermal management with airflow predictions, temperature, and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, and power electronics.
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